Labem | Chip bonder

Chip bonders

Finetech produces chip bonders designed for various applications and with various possibilities. The models listed below differ significantly in technical parameters and the possibility of their application to systems of various types. Please contact us by phone. We will send you detailed data and prices.

Finetech produces chip bonders designed for various applications and with various possibilities. The models listed below differ significantly in technical parameters and the possibility of their application to systems of various types. Please contact us by phone. We will send you detailed data and prices.

Labem | Chip bonders

Typical Applications:

  • Bonding of laser chips

  • Bonding of RFID tags (Radio Frequency Identification)

  • Adhesive technology with high precision

  • Bonding VCSEL and photodiode

  • Glueing chips to a glass substrate - Chip-On-Glass technology

  • Thermocompression - used to make Flip-Chip connections without the need for wire-bonding connections

Labem | Chip bonders

For production and for the laboratory:

Fineplacer ®

Fineplacer ® Pico ma

Universal bonder

  • Accuracy of 5 microns
  • universal bonder for various applications

Universal bonder

  • Accuracy of 5 microns
  • universal bonder for various applications

Fineplacer ®

Fineplacer ® Lambda

Universal bonder

  • Accuracy of 0,5 microns
  • very precise bonder for various applications

Universal bonder

  • Accuracy of 5 microns
  • very precise bonder for various applications

Fineplacer ®

Fineplacer ® Lambda2

Universal bonder

  • accuracy of 0,5 microns
  • very precise bonder for various applications

Universal bonder

  • Accuracy of 5 microns
  • very precise bonder for various applications

Fineplacer ®

Fineplacer ® Sigma

Semi-automatic bonder

  • accuracy of 0,5 microns
  • bonding force up to 1000N

Semi-automatic bonder

  • accuracy of 0,5 microns
  • bonding force up to 1000N

Fineplacer ®

Fineplacer ® Femto 2

Automatic bonder

  • accuracy of 0,5 microns @ 3 Sigma!
  • high efficiency

Automatic bonder

  • accuracy of 0,5 microns @ 3 Sigma!
  • high efficiency

Fineplacer ®

Fineplacer ® FineXT 6003

Automatic bonder for serial production

  • accuracy of 3 microns
    high efficiency
  • large working area

Automatic bonder for serial production

  • accuracy of 3 microns
    high efficiency
  • large working area

Fineplacer ®

Fineplacer ® FineXT 5205

Automatic bonder for serial production

  • Accuracy of 5 microns
  • high efficiency, Multi-Chip assembly

Automatic bonder for serial production

  • Accuracy of 5 microns
  • high efficiency, Multi-Chip assembly